As ROG is always innovating, never imitating, we’ve patent pended our Fusion Thermo solution on the Maximus V Formula. Hit the PR button below for more details.

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Press Release

Taipei, Taiwan—23 July, 2012

World’s first hybrid heatsink combines air and water cooling readiness on Maximus V Formula motherboards, as recommended by leading vendors of liquid cooling kits 

Making its first appearance on the ASUS ROG Maximus V Formula gaming and overclocking motherboard, Hybrid Thermal solution combines enhanced passive air heat dissipation with liquid cooling readiness. It represents another ROG exclusive, and the first such design on any commercially-available motherboard. ASUS has applied for a Hybrid Thermal solution patent, and the feature has garnered official endorsement from ten of the most renowned makers of liquid cooling hardware, including Swiftech® and EKWB. Hybrid Thermal solution offers customers the utmost thermal flexibility and efficiency for intense gaming, overclocking, and case modding. 

 

Patent-pending Hybrid Thermal solution debuts

Maximus V Formula first introduced the Hybrid Thermal solution at the ASUS Z77 global seminars in February, showcasing the world’s first design of its kind. It consists of a premium aluminum heatsink, which expedites heat removal beyond the capabilities of standard materials. Inside, a high-efficiency heatpipe conducts temperatures away from CPU VRMs for enhanced stability, providing excellent performance in typical air-cooled setups. The key aspect of Hybrid Thermal solution is its hybrid design, embedding an all-copper water channel within the heatsink alongside the heatpipe. It is therefore equally efficient for air cooling as it is in water cooling, so that customers are ready for both for greater thermal efficiency and flexibility. On each end of Hybrid Thermal solution, electroplated barbs can easily connect to liquid cooling setups, which are made simpler with less hardware modification and faster installs. ROG tests show that Maximus V Formula with the Hybrid Thermal solution operates 30% cooler when fitted with a Swiftech® H20-320 Edge water cooling kit compared to passive dissipation, and 20% cooler than passive heat removal when equipped with an H30 360 water cooling kit from EKWB. ASUS has applied for a Hybrid Thermal solution patent, owing to the feature being a world exclusive that has been entirely designed in-house.

 

Recommended by the world’s leading water cooling vendors

Based on independent tests and usage, ten of the most established providers of liquid cooling systems have officially endorsed the Hybrid Thermal solution. They are EKWB, Swiftech®, Thermaltake, Zalman, Alphacool, Aquacomputer, XSPC, Koolance, Bitspower, and Watercool.de. All praise Maximus V Formula for its advanced features and accommodation of a hybrid air and water cooling design, and for the Hybrid Thermal solution’s high degree of compatibility with their products.

 

Click here for additional details about the Hybrid Thermal solution.

 

Vendors react to the Hybrid Thermal solution

“We’re very excited to see ROG, as the world’s leading gaming motherboard brand, developing a flexible hybrid design such as the Hybrid Thermal solution for its products, which in turn will help bring the full benefit of water cooling to more PC enthusiasts globally”, said Gabriel Rouchon, Swiftech® Chairman.

 

“As a company who is offering the widest product range for ASUS models, we found that installing a water cooling kit is much easier on the ROG Maximus V Formula with ROG’s Hybrid Thermal solution, which therefore helps our products reach a wider audience. It has also proven highly compatible with our designs, and much more efficient than conventional cooling in terms of lowering temperatures for better system stability and overclocking potential”, commented Edvard König, EKWB Managing Director.



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