Beat the heat
Heat dissipation is faster and more efficient with our vapor chamber design, which vastly increases surface area compared to traditional heatpipe systems. Unlike conventional heat pipes that only transfer heat along their axis, vapor chamber designs spread heat across their entire surface, allowing the vapor chamber to rapidly absorb and dissipate waste heat without adding extra bulk to the machine. This efficient heat transfer also keeps the surface of the laptop cooler, keeping your hands comfortable for the entire game.
*Vapor chamber design only available on G733CX. Visual effect is for demonstration only.
Unleash the Grizzly
Cooling is one of the greatest challenges facing gaming laptops, and ROG is constantly pushing the envelope. This drive led to liquid metal, which is extremely effective at transferring thermal energy between surfaces like a processor die and heatsink.
The SCAR 17 SE takes this evolution one step further, with the use of Conductonaut Extreme liquid metal applied to both the CPU and GPU. This ultra-high performance thermal interface material can reduce temperatures by up to a staggering 15°C compared to traditional thermal pastes.
*Temperature improvements compared to regular thermal paste, as tested internally by ASUS. Thermal conductivity compared to industry standard.
Cooling is one of the greatest challenges facing gaming laptops, and ROG is constantly pushing the envelope. The SCAR 17 SE takes this evolution one step further, with the use of Conductonaut Extreme liquid metal applied to both the CPU and GPU. This ultra-high performance thermal interface material can reduce temperatures by up to a staggering 15°C compared to traditional thermal pastes.
*Temperature improvements compared to regular thermal paste, as tested internally by ASUS. Thermal conductivity compared to industry standard.
