To monoblock or not to monoblock?

[LiveOrDie]

I didnt HAVE A 7940x I went to the 9940X for more cores and gut lucky with an extremely good sample on the first try, first time ever. My last chip which I still have and will deploy to another build is a 5GHz 7900X that was delidded and binned by SL. Bought my luck with that one and also bought it with a 1 year warranty from them because as soon as the lid comes off the Intel warranty goes with it.

I see shopify and I want to puke. My wife thought it made for a good shopping experience and got scammed. the seller is still on there only removed the contact info. She ordered several hundred $$ in product in November.....No nothing and finally just reported them for CC fraud.


Looking at their product image that IHS hasn't been lapped and it doesn't state it has either. properly lapped surfaces are very shiny like a mirror. How well it works is subjective. Honestly im not too convinced with the whole change in adhesive affecting the height. If it was higher before how was it making contact with the die? Whats matters is die to IHS. If you glue it back on the relid must be certain that the contact with the die is good and you are not using a monoblock is all that matters.

I have my IHS sitting in front of me and its lapped mate just because your going off a image doesn't mean jack lol and rockitcool is trust worthy they also sell ROCKIT delid tools which i have bought also.

Seeing EK even knows the fact that delidded CPU don't make correct contact with there monoblocks says there is a issue there with the height of the IHS, and yes the silicon does add height and a gap between the IHS and die, this gap is just filled with crappy thermal paste why do you think when changing the paste with LM drops temps 15c its not just because is crappy paste its because its not sitting flat on the die, each CPU comes down a production line with the same pressure applied to the IHS leaving the same gap, don't get me wrong the gap is small and I wont be able to tell until i reinstall my CPU with the copper IHS to check my temps.

Like i have said before delidding your CPU doesn't void you warranty if you delid it and kill your CPU sure, if it fails due to other means just remove the LM and put the normal paste back and silicon it back down, not sure any may times I need to say this but people do it all the time and never heard of any being rejected for a RMA.

[LiveOrDie]

IHS is bigger for better cooling ?

Thanks

Yes they account for the silicon so monoblocks make the correct contact.

[Abaidor]

Yes they account for the silicon so monoblocks make the correct contact.

LoL nice....I have bought everything for going direct die, new CPU Block, VRM block, Monoblock, Liquid Tape, Have RTV Silicon so why not...let's get an extra IHS too...

This CPU overclock has been the most expensive in my computing history but I am on a quest to hit the highest clocks possible on a 14 core CPU. Last year was the "Build" year where I migrated from an old PC...2019 will be the fine tuning year along with some case modding fun and Hard Line bending.

I was out of this hobby for over 8 years because I was spending too much only to get into Home Cinema / Audio which was even worse and then kids were born...and now my son wants a gaming PC too (that I am building)

Anyway, I am back to my PC roots as one of my main hobbies and again I am seeing my self spending a lot on PCs but damn I like it...I will either have to stay away from forums like this or it won't stop..


Regarding the monoblock, has anyone with the Rockit IHS managed to "save" the monoblock while also getting good temps with a delidded CPU?

[Brighttail]

I have my IHS sitting in front of me and its lapped mate just because your going off a image doesn't mean jack lol and rockitcool is trust worthy they also sell ROCKIT delid tools which i have bought also.

Seeing EK even knows the fact that delidded CPU don't make correct contact with there monoblocks says there is a issue there with the height of the IHS, and yes the silicon does add height and a gap between the IHS and die, this gap is just filled with crappy thermal paste why do you think when changing the paste with LM drops temps 15c its not just because is crappy paste its because its not sitting flat on the die, each CPU comes down a production line with the same pressure applied to the IHS leaving the same gap, don't get me wrong the gap is small and I wont be able to tell until i reinstall my CPU with the copper IHS to check my temps.

Like i have said before delidding your CPU doesn't void you warranty if you delid it and kill your CPU sure, if it fails due to other means just remove the LM and put the normal paste back and silicon it back down, not sure any may times I need to say this but people do it all the time and never heard of any being rejected for a RMA.

If this little $25-45 dollar item fixes the gap issue with the monoblock because it is raise slightly or thicker, it is worth its weight in gold. Sadly I don't have a delidder as mine was done by Silicon Lottery but to get a delidder and getting the liquid metal and gunk to hold it all together may be worth the $100 price tag to do it all yourself. Folks at Silicon Lottery said they would do it too if you sent this with your CPU and they wouldn't charge anymore than they would a normal delidding process. It is something I'm definitely interested in to see if folks with monoblocks go this route as to what the results are. Stable temps over all cores would be worth it even if the overall temp doesn't come down.

[JustinThyme]

Im still having an issue wrapping my head around this change in gap theory. The way I see it is you have the top of the die then the IHS sitting on that that is or isn't glued down then the thickness of the IHS. If the distance from the mount to the top of the IHS changes then the IHS was never sitting on the die in the first place. I get the change from the top of the die to the top of the PCB changing as in the distance of the sides of the IHS being not long enough to meet the PCB of the chip anymore but how does that change the distance of the heat sink? Die+IHS thickness never changed?

[Roger3006]

For my 7900 the difference at idle is negligible and not so bad at sustained but there are a couple cores that spike 20-30 degrees higher but don't stay there. Cores 2 and 8 are my worst with 3 being irritating at times. The temps under load seems to be fairly consistent with the exception of those two cores. Perhaps they are on the outside of the CPU. I've never done the spin test on this CPU but i do know if you lap it, it will kill any warranty but the warranty is already dead as I delidded this, so next time I change fluid out I'll test it and see if it needs any lapping. Personally I'd be a little more concerned if the idle temps were 10-30 degrees different rather than a stress test.

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FYI- You could have shown the temp readings to me and I would have thought it came from my 7900X, all the way down the spikes in 2 and 8.

[JustinThyme]

FYI- You could have shown the temp readings to me and I would have thought it came from my 7900X, all the way down the spikes in 2 and 8.

Are you using a mono block?

[LiveOrDie]

Im still having an issue wrapping my head around this change in gap theory. The way I see it is you have the top of the die then the IHS sitting on that that is or isn't glued down then the thickness of the IHS. If the distance from the mount to the top of the IHS changes then the IHS was never sitting on the die in the first place. I get the change from the top of the die to the top of the PCB changing as in the distance of the sides of the IHS being not long enough to meet the PCB of the chip anymore but how does that change the distance of the heat sink? Die+IHS thickness never changed?

That's right the IHS isn't designed to sit flush on the die there's always a gap, before delidding tools come about people used blades to cut the silicon which holds the IHS, this wouldn't be possible if there was no gap, if you pick up any CPU you can see the silicon in between the PCB and IHS.


Have a read about it here https://linustechtips.com/main/topic...-temperatures/

[Brighttail]

Im still having an issue wrapping my head around this change in gap theory. The way I see it is you have the top of the die then the IHS sitting on that that is or isn't glued down then the thickness of the IHS. If the distance from the mount to the top of the IHS changes then the IHS was never sitting on the die in the first place. I get the change from the top of the die to the top of the PCB changing as in the distance of the sides of the IHS being not long enough to meet the PCB of the chip anymore but how does that change the distance of the heat sink? Die+IHS thickness never changed?

I'm a bit confused as well but I figured. if a normal CPU makes contact with a monoblock and then you delid that CPU, scrape away the old TIM and put a thinner layer of liquid metal on it and reattach it... I guess we are seeing that .5 of a mm less, means the monoblock isn't making as full contact with the CPU and thus that makes a thermal difference.

[LiveOrDie]

I'm a bit confused as well but I figured. if a normal CPU makes contact with a monoblock and then you delid that CPU, scrape away the old TIM and put a thinner layer of liquid metal on it and reattach it... I guess we are seeing that .5 of a mm less, means the monoblock isn't making as full contact with the CPU and thus that makes a thermal difference.

It isn't the TIM at all it's the adhesive used as shown here by EK.