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Reason behind high overclock temps on Ivy Bridge

Rocket_Assist
Level 7

‎05-28-2012 12:36 AM - last edited on ‎03-06-2024 08:46 PM by Community Admin

It seems that the reason behind the high overclock temperatures on IB processors is the result of Intel choosing to use a standard TIM between the die and IHS instead of Intel's much superior fluxless solder, which was used on the previous generation SB processors. Intel went from a medium of ~87 W/mK to ~5 W/mK.

In testing, replacing the thermal TIM with a better material, specifically Liquid Pro, drastically reduced temperatures on a 3770K. Temperatures decreased by 11c at stock speeds and 20c at an overclock of 4.6 GHz.

Long story short, Intel sabotaged its own product.

http://hexus.net/tech/news/cpu/39369-intel-cuts-corners-ivy-bridge-thermal-interface-material-tim/
http://www.overclockers.com/ivy-bridge-temperatures
http://download.intel.com/technology/itj/2008/v12i1/1-materials/1-Materials_Technology_for_Environme...
http://pc.watch.impress.co.jp/docs/column/sebuncha/20120511_532119.html
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Arne_Saknussemm
Level 40

‎05-28-2012 04:07 AM

If that's true, it's a bit beyond ridiculous!!:rolleyes:
ARNE’S GUIDE TO PC BUILDING HAPPINESS

ARNE'S GUIDE TO OVERCLOCKING HAPPINESS
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Zka17
Level 16

‎05-28-2012 05:02 AM

Well, I assume that Intel was willing to cut in production expenses... Had somebody compared/calculated the price of the CPU having better thermal solutions versus the present built? Maybe the buyers would not like so much those numbers...
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Rocket_Assist
Level 7
In response to Zka17

‎05-28-2012 12:00 PM

Zka17 wrote:
Well, I assume that Intel was willing to cut in production expenses... Had somebody compared/calculated the price of the CPU having better thermal solutions versus the present built? Maybe the buyers would not like so much those numbers...

That's seems to be the general theory, but like I said, fluxless solder was the method used on SB. While it isn't necessary, the stock models would be fine using TIM. However, it's expected on the K models, which are marketed as overclocking chips. One conspiracy theory I read was that Intel intentionally sabotaged the chips to boost sales of enthusiast (LGA2011) chips.

Arne Saknussemm wrote:
If that's true, it's a bit beyond ridiculous!!:rolleyes:

It's true.
Sandy Bridge
8898
Ivy Bridge
8897
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Adamfal
Level 7
In response to Rocket_Assist

‎05-28-2012 12:40 PM

Well I was going to pop for the IB cpu but now I think I will stay with the SB on my new build lol.
Evil~Ways!
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Zka17
Level 16
In response to Rocket_Assist

‎05-28-2012 04:21 PM

Rocket_Assist wrote:

Ivy Bridge
8897


Could just simply the CPU cooler be attached directly to the CPU Die, without the IHS?

Maybe Intel wanted to do a favor to modders... :cool: Now, beside lapping the IHS there is an other method to mod the CPU. 😄
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Rocket_Assist
Level 7
In response to Zka17

‎05-31-2012 03:36 PM

Zka17 wrote:
Could just simply the CPU cooler be attached directly to the CPU Die, without the IHS?

Maybe Intel wanted to do a favor to modders... :cool: Now, beside lapping the IHS there is an other method to mod the CPU. 😄

The whole direct die cooling thing was before my time, so I'm not very knowledgeable about it. Some coolers may work, but the direction that the IHS has taken the cooler market is a problem. Direct contact heat pipe coolers are out, as they are designed to dissipate heat from the entire area of the IHS, as are many modern waterblocks. They wouldn't be very efficient at dissipating heat from an area less than .25" square (the size of the die). What is required is something like the MC-TDX that concentrates cooing directly over the die, or in this case, on the die. However, the die PCB is apparently very fragile without the IHS. Not to mention that the IHS is part of the mounting system and that removing it will almost certainly void the warranty.
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