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  1. #21
    ROG Guru: Orange Belt Array HK-47's Avatar
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    When putting on thermal compound I use a credit card and spread a very thin even layer of it over the entire CPU cooler. I then use a que-tip and wipe around the entire edge of of the cooler about the width and a half of a que-tip. These Chips are a little larger then older CPUs and I have found using small dots over the cpu does not spread evenly always and you end up with places with to much compound and others with out enough or ripples in the compound. When using this method just make sure the area you wipe off is enough. You want enough room so that when you apply pressure by attaching the cooler it does not squeeze out over the edge of the cpu.
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  2. #22
    ROG Guru: Brown Belt Array HalloweenWeed's Avatar
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    Quote Originally Posted by HK-47 View Post
    When putting on thermal compound I use a credit card and spread a very thin even layer of it over the entire CPU cooler.
    That can cause air bubbles HK, as shown here:
    IC Diamond application instructions with discussion about air bubbles

    About 3/4 of the way down that page: "Figure 9 - Full spread with Air Pockets

    Same application as above clamped between two glass slides note the white spots these are the initial air bubbles. Again the issue or problems with air bubbles is that air is very difficult to compress and will expand under heat and pressure which will displace the TIM with voids"

    This vid is excellent, and shows it well, look at 2min in:
    YouTube: How Thermal Compound Spreads

    This is just two of many that show the folly of the credit card spread HK. It is not advisable.
    Last edited by HalloweenWeed; 01-13-2013 at 03:37 AM. Reason: Added YouTube vid
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  3. #23
    ROG Guru: Orange Belt Array HK-47's Avatar
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    Well different strokes for diffrent folks. I have been using this method for years and never had a issue. And the problem with air bubbles is not it expanding. Air is a poor conductor of heat compared to copper/metal. The thermal paste job is to fill in the micro imperfections in the surfaces of the heatsink. Thermal paste conducts heat worse then copper/metal but it is better then air. The thinner you get it the better, less is more when it comes to heat transfer between heatsink and the cpu. To much thermal compound can have a negative effect as well. Ideally both surfaces would be completely flat and little to no thermal compound would be need .This is why people lap heatsinks to the cpu with micro polishing compounds.
    Last edited by HK-47; 01-13-2013 at 04:00 AM.
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