SweClockers -Intel Haswell-E is launched on August 29

[randyenergy]

Have an eye out for used X79 boards and cpu's when X99 arrives. People will probably be selling alot of those to cover the costs of those expensive DDR4 sticks

Those X79 have been revved. I rather take a brand new Z79.

[twisted1]

But on Z97 you can only have 4 cores +HT. On X79/S2011 you can have 6 cores +HT. And that's pretty much the point of haswell-E also, more cores then what the mainstream platforms offer.

[Arne Saknussemm]

"new" epoxy tim instead of solder might be recipie for heat issues.

Yeah, you spotted that as well twisted...I have been wondering about this...not much comment anywhere...people seem to say they are soldered but they aren't...some kind of epoxy....will have to wait and see....

[Menthol]

http://wccftech.com/intels-flagship-...face-material/

So it's not soldered after all, that's a pisser

[Arne Saknussemm]

All in the name of being "green" http://www.lsi.usp.br/~acseabra/grad...0Packaging.pdf

I hope they are still using indium solder....or hope epoxy has caught up to the 87 w/mk mark or surpassed it?

Whatever, I hope it's not cream cheese under there like Haswell etc.

[MatsGlobetrotter]

Well its good if its indium as it is heavy and soft metal:-) but on wikipedia it say 81.8 W/mk and if it is in some kind of epoxy solution it would be lower. However with a 156.6c melting point it would be possible to heat the metal and glue/solder it to the substrate and topcover without causing issues to the solder around thus if it somehow is applied like a epoxy compound which is heated to properly melt/glue then it would be very much the same as liquid metal. That must be many times better than the crazy TIM i found in my 4770 with airgaps in between aswell. Since the 4790 k was much better is it the same they used or will the indium be even better than that. I would think they have learned the lesson to not go as bad as they did on 4770 series. You can only fool the market for so long;-)

[twisted1]

All in the name of being "green" http://www.lsi.usp.br/~acseabra/grad...0Packaging.pdf

I hope they are still using indium solder....or hope epoxy has caught up to the 87 w/mk mark or surpassed it?

Whatever, I hope it's not cream cheese under there like Haswell etc.

It's epoxy with metal in it, not your off the shelf epoxy But the heat transfer of good epoxy bond is still not much better then that of a good thermal paste. And you can't delidd it :/

But we'll see when the cpu's hit the market, hoping for solder.

The only advantage epoxy bond has over solder bond is the cost, cheaper.

I don't know why every news site has missed this, intel probably gave them guidelines on how to write the article when this "leak"(yeah right, it's called marketing) occured. Since all the sites basically write exactly the same thing.

[Menthol]

the 8 core chip is clocked lower than the six core so I assume it won't clock as high as the 6 core, which benches will benefit from more cores at a lower frequency. What do you think it will end up being, 8 core 4GHZ, 6 core 4.4 GHZ, or even less. Will we see some real numbers show up soon, if it gets released on the 29th of this month we should be seeing something concrete soon shouldn't we

[twisted1]

The numbers I've seen floating around the web says 3.0Ghz for the 8 core as base clock. And 3.5Ghz for the 6 core cpu.

Here's some more info on epoxy bonds btw.

"To compare epoxy bonds to solder bonds one has to ask the purpose of the bond… Is strictly a mechanical bond ? Is cost a large factor? If cost drives the choice then many times epoxy is the bonding material of choice. Epoxies are generally low cost thermosetting polymers, that are mixed chemicals which are thermally or UV cured to achieve hardness and adherence. Epoxy by far is the lower cost material over solder metal fillers and thus if low cost is the driving aim of the bond, then epoxy will be the bonding material selected. - See more at: http://www.s-bond.com/blog/2013/08/27/epoxy-bond-soldering/#sthash.6wgIUr6N.dpuf"


"When bonds have to be thermally conductive or electrically conductive solders are usually the bonding material of choice. Solder are metal fillers melt below 450˚C are normally alloys of Sn, Ag, Pb, In, or Bi with the Pb-free alloys being preferred for environmental reasons. As metals, these materials are intrinsically 10 – 100 time more conductive than epoxy bonds. In recent year epoxy bonds have been filled with aluminum or silver particles to increase the epoxy bond filler conductivity to values of 3 – 5 W/m-K from 0.5 – 2 W/m-K. When compared to solder bond metals with conductivities of 40 – 400 W-m-K, one can see for thermal bonded components that solder bonding would be preferred. S-Bond Technologies makes active solder alloys that bond to metals, ceramics, glass and their combinations without the need for flux or plating and are many times selected over epoxy bonds for their improved thermal characteristics. - See more at: http://www.s-bond.com/blog/2013/08/27/epoxy-bond-soldering/#sthash.6wgIUr6N.dpuf"

[Arne Saknussemm]

intel probably gave them guidelines on how to write the article when this "leak"(yeah right, it's called marketing) occured.

Yes, has all the hallmarks of that kind of thing. I can´t believe there isn´t one site that has asked questions about this or asked for the facts...just copied and pasted what they are given...

Could be the epoxy holds the silicon to bottom and there is solder there...? there is a gold layer there that would apparently mean solder...

http://link.springer.com/article/10.1007%2Fs11837-006-0186-6#page-1

click "look inside"

crosses fingers