What are the specs for the TIMs used (by Asus) on this motherboard?
According to
this review -
The heatsink covering the PCH is a pretty large affair that uses the thick pink TIM we often see ASUS use here. The MOSFET heatsink uses thermal pads that cover both the MOSFETS and the top of the chokes. The DirectCU copper pipe was found under the thermal pad covering the MOSFETs. The heatpipe then joins the heat dissipating block that covers the I/O area. There is no thermal interface material on the block as its purpose is to provide an escape route for any heat that it receives through the heatpipe. On the back of the motherboard is another plate that’s attached to the bottom of the MOSFETS, and it too uses a pad for thermal interface material.
(Bold emphasis is mine.)I'm not really willing (at this time) to take my R5E mobo apart and void warranty just to check out the TIMs firsthand. But I am interested in knowing what these TIMs are and whether I can replace them with anything better. Are the "thick pink TIM" and thermal pads just cheap, generic, bulk factory-issue filler or are they premium performers? Specific details about brand, product, model information, part numbers, or at least detailed thermal specs would be preferred.
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