Saying 3007 is buggy is an understatement.*
There is a known issue with voltages with even the Z270 platform causing these chips to be a bit on the warm side and to add insult to injury every chip is different, even more so in the beginning of production. *Some will run cooler than others simply due to silicon attributes. Now add even more injury to the insulted injury the IHS TIM material and methods being used is still about as effective as toothpaste. Actually the toothpaste might be better. Either way they are very inconsistent from one to the next. All intel is worried about is that it meets its advertised clocks without self destructing. *Nothing implied about how much heat it generates (other than overtemp).*
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There is a known issue with voltages with even the Z270 platform causing these chips to be a bit on the warm side and to add insult to injury every chip is different, even more so in the beginning of production. *Some will run cooler than others simply due to silicon attributes. Now add even more injury to the insulted injury the IHS TIM material and methods being used is still about as effective as toothpaste. Actually the toothpaste might be better. Either way they are very inconsistent from one to the next. All intel is worried about is that it meets its advertised clocks without self destructing. *Nothing implied about how much heat it generates (other than overtemp).*
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In my experience on M8E, bios 2202 only gave basic support for KL, 3007 gave full support as in bios 2202 I could not adjust the CPU multiplier, blck, etc. bios 3007 I could change all bios settings, a single fan AIO is fine for mild overclocks but a dual fan is much better
