Hi Woelund
🙂A commonly asked question on what to use and how to apply TIM. (Oils ain't Oils and TIM ain't TIM)
It does make a difference as to what you use. I use either AS5 or MX4 which have very similar thermal conductive properties. A TIM is good if it is like grease in consistency and not a thick oil. It should be applied as sparingly as possible to fill just the tiniest of Voids. TIM should not squeeze out the sides of the thermal plate
😞 as it can cause issues and applying too much will deplete thermal efficiency.
The most common practice is to apply a small pea sized blob to the center of the CPU and tighten down the brackets in a crosswise pattern in incremental steps and only finger tight.
Most pre-applied pastes are OK but I personally clean it off and meticulously clean both surfaces with Isopropyl Alcohol 95%. I'm probably a little pedantic as I will lap the CPU ground surface if its too coarse.
To get it right for first timers its best to have a trial run, apply then check the spread.
The good TIM contains metallic oxides and as dissimilar metals can react, It's best not to mix them.
For those technically inclined, TIM is rated by its thermal conductivity.
Thermal conductivity λ is defined as the ability of material to transmit heat and it is measured in Watts per
square metre of surface area for a temperature gradient of 1 K per unit thickness of 1 m. W/mK
AS5 = 8.9 W/mK
MX4= 8.4 W/mK
Some pastes are only 1.2 W/mk and should be avoided.
Some pastes harden and become an adhesive causing damage when thermal plate is removed.
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