04-28-2017 01:58 PM - last edited 3 weeks ago by ROGBot
04-28-2017 02:17 PM
04-28-2017 02:29 PM
04-28-2017 02:52 PM
04-29-2017 03:47 AM
Klute_Onren wrote:
Just wanted to get thought's on deliding a cpu and leaving off the IHS. I know this isn't recommended but I'm still going to do it unless thing's have changed in the past 15 year's. My first custom built rig was an Athlon XP-m 2800+ and it had no IHS so I have experience handling a naked die. Just thought I'd throw this out there incase anyone has a really strong argument.
Another talking point: Should I go with gallium on naked die or arctic silver? I'm leaning towards gallium but I'm worried there will be no room for error or potential for an air gap.
04-29-2017 11:06 AM
JustinThyme wrote:
Things have changed in the past 15 years, dramatically. I too in the past snatched off the IHS and left it off. Problem now is the wafers are so thin you risk cracking the substrate. Same reason you have to be very careful delidding, they are fragile! With the IHS off you would also have to find a different clamping method as the clamps rely on the IHS to hold the CPU in place and by design spead that force out. Without the IHS all of the force is going down on your die in the center where nothing is under it and will cause the edges to bow up and possibly bend pins or in the least outer pins wont make good contact.
04-29-2017 11:12 AM
04-29-2017 11:23 AM
04-30-2017 05:36 PM
04-30-2017 05:47 PM