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Seriously Cool. Surprisingly Quiet.

ROG uses a strategic mix of hardware and features to achieve ideal cooling for each combination of components and chassis, while keeping noise levels low. Cutting-edge fan design and liquid metal work together with smart software to optimize your experience for work and play.

Conductonaut Extreme liquid metal
reduces CPU temperaturesVapor Chamber covers more area for efficient heat removalPulsar Heatsink dissipates more heat with ultra dense fins0.1mm ultra thin fins expel heat fast6 heatpipes
cover the CPU, GPU,
VRM, and VRAM
Scenario Profiles automatically adjust
cooling modes0dB Ambient Cooling
keeps your laptop truly silent
Frost Force Technology
boosts internal airflow with three fansDust Filter helps keep dust and fibers outInternal Blast Technology directs air toward critical componentsAnti-Dust Tunnels 2.0 sustain system longevityAAS Plus 2.0 increases airflow space by 30%Arc Flow Fans™
increase airflow by up to 32%

Keep your

CPU cool

with liquid metal

Over a year of testing with various processors, ROG engineers observed reductions in temperatures up to 10 degrees Celsius with liquid metal, depending on the CPU. And unlike typical pastes, liquid metal will also never dry out, improving long term stability.​

New for 2022, select ROG models now feature Thermal Grizzly’s cutting-edge Conductonaut Extreme, which improves liquid metal's heat transfer even further. Compared to traditional thermal pastes, this indium- and gallium-based compound offers 17X higher conductivity and CPU temperatures up to 15 degrees cooler. Used exclusively by ROG, this material offers the highest thermal transfer available on a laptop.​

*Temperature improvements compared to the previous gen thermal compound, as tested internally by ASUS. Thermal conductivity compared to industry standard.
Up to
15°C cooler
CPU temperature
17X better
thermal conductivity

Frost Force Technology

At the heart of every great laptop is a great cooling solution. Our new Frost Force Technology directs air though precisely calculated cutouts in the chassis, sending airflow directly towards internal components to keep them cool in all conditions. A third auxiliary fan also helps to send additional heat from the GPU directly to the heatsinks, keeping the machine cool during long video renders or gaming sessions.

Targeted Airflow with

Internal Blast Technology

Internal Blast Cooling uses precisely calculated cutouts in the chassis to direct airflow toward internal components. When compared to more traditional designs, this allows for more efficient cooling, reducing CPU and GPU temperatures by up to 6°C. Lower temperatures mean higher sustained boost clocks during intense gaming sessions.

Up to
6°C
CPU and GPU temp

Upgraded

Arc Flow Fans™

move more air with less noise

Slim chassis leave little room for cooling, so we enhance every aspect of our Arc Flow fans. Traditional fan blades have a single thickness from base to tip. Our 84-blade Arc Flow Fans™ have a variable thickness design, down to 0.1mm at the tip. This approach reduces resonance and turbulence, moving up to 13% more air.*

*Compared to previous 83-blade ROG fan design, as tested internally by ASUS.
Up to
13%
more airflow
84-blade
down to 0.1mm
LCP fans

Variable Blade Thickness

design reduces air collision

Our fans use blades of variable thickness and shape to reduce turbulence and maximize airflow efficiency. By changing from a high to low pressure area gradually before being expelled by the fan, the air turbulence is drastically reduced compared to traditional fan blade designs. This patented new design is made possible by the latest liquid-crystal-polymer processing technologies that allow us to create ultrathin, strong fan blades for increased air intake.

With Variable Blade ThicknessLess air collision
Without Variable Blade ThicknessMore air collision

Anti-Resonance design

reduces turbulence

Our new Arc Flow fans were inspired by the most aerodynamic designs found in nature. Each blade is capped with a tip to regulate airflow, the same way that a bird’s feathers are tipped to keep the bird balanced in flight. The blade caps use a wave pattern that is inspired by the variegated wingtips of a bird; guiding the flow of air around the fan while minimizing turbulence for maximum efficiency.

With Anti-Resonance DesignIncrease airflow efficiency
Without Anti-Resonance DesignDecrease airflow efficiency

0dB Ambient Cooling

, Zero Distractions

Enjoy truly silent cooling under light workloads with 0dB Technology. In the Silent operating mode, the cooling system switches off all fans during everyday tasks to dissipate heat passively. This lets you concentrate on your work and immerse yourself in movies with less distraction. If CPU or GPU temperatures increase, the fans automatically switch on again.

Filter

in.

Dust

out.

First introduced on the Zephyrus G14, the ROG Flow X16 features a dust filter on its intake vents. Dust and fibers can collect inside the machine, trapping heat and causing degraded performance over time. A filter helps keep dust out, allowing the CPU and GPU to breathe easier for years of smooth and stable operation.

*Internal testing in a simulated dusty environment.

Second generation

Anti-Dust Tunnels

eject debris

Our upgraded thermal module design features shorter anti-dust tunnels that leave up to 5% more space around the fan, improving airflow by up to 15%. Preventing the buildup of dust ensures the long-term stability and reliability of your system.

Up to
15%
better fan performance
Up to
5%
more airflow

Open up the vents with

AAS Plus 2.0

Active Aerodynamic System Plus (AAS Plus) pushes the AAS concept further on select models, opening a massive 28.5mm air intake behind the tilted secondary display that increases airflow by up to 30%. Instead of drawing in air from below the laptop, where components can warm incoming air, this top-facing vent draws cooler air from above. The larger space also helps keep noise levels below 43dB in performance mode, enabling a quieter gaming experience.

*Exclusive on ROG Zephyrus Duo series.
Wide
28.5mm
airflow intake
Up to
30%
more airflow
Up to
3dB
less noise
Wide
28.5mm
airflow intake
Up to
30%
more airflow
Up to
3dB
less noise

Vapor Chambers

dissipate heat faster

Compared to conventional heat pipes that only transfer heat along their axis, vapor chamber designs spread heat across their entire surface, creating a wider area for heat dissipation to rapidly lower temperatures in small spaces. Our design also uses a rectangular thermal plate to draw heat away from not only the CPU and GPU, but also the power regulation circuitry. Reducing the temperature of these power components helps improve long-term stability and reliability.

* Exclusive on the ROG Strix G15 Advantage Edition.

Up to 6

comprehensive heatpipes

got you covered

Our comprehensive solution uses up to six heatpipes and quad heatsinks for efficient dissipation across all internal components. More heatpipes means more efficient heat transfer, and unlike simpler designs which only cover the CPU and GPU, this layout also draws heat away from the video RAM and voltage regulation modules for better system stability.

Up to
25%
thermal coverage
Up to
6 heatpipes
on CPU/GPU/VRM/VRAM
Up to
252 fins
quad heatsinks

Pulsar Heatsink

dissipates more heat

The X16 features 330 heatsink fins, with each stack lined with ultra-thin copper fins as slim as 0.1mm. This allows for higher density and lower air resistance, with a total of 110,902mm² of surface area. This all-copper construction continues to the Pulsar Heatsink, which is double the size of a normal heatsink and covers the entire rear of the machine.​

0.1mm ultra thin fin

for the win

Thermal energy is dissipated by four heatsinks, each lined with ultrathin copper fins as slim as 0.1mm. These fins are half the size of typical solutions, allowing for higher density for heat dissipation and lower air resistance to allow for smoother flow. There are up to 252 heatsink fins totaling 110,328mm² of surface area.

Up to
13%
better heat dissipation
Up to
7%
less air resistance
Up to
69%
faster thermal conductivity

Scenario Profiles

give you the right cooling at the right time

Our Silent, Performance, and Turbo modes are just the beginning. Scenario Profiles allow your system to automatically switch between them based on the application you're running, alongside other vital system settings. Switch between lighting configurations automatically, disable the Windows key and touchpad during games, and automate to your heart's content. Armoury Crate makes adjustments in an instant to best fit the task at hand.

A low power state that disables the fans completely during light computing for a silent experience.Fans will ramp higher than in Performance mode, allowing more potential performance, but increasing fan noise.Default fan and power mode ramps up fans automatically when needed. The recommended mode.Manual mode allows you to tweak the settings exactly the way you want.
CoolingNoise ReductionEnergy SavingGPU PerformanceCPU Performance

Explore all the gaming laptops that feature ROG Intelligent Cooling

No matter the situation, ROG has a solution that will blow you away. Explore all the gaming laptops that feature ROG Intelligent Cooling at the links below. Laptop gaming has never been cooler.

Explore all the gaming laptops

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