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ROG Flow X16 (2023) GV601

Powerful components are a key factor in gaming performance, but that power is sometimes left on the table when paired with a lackluster cooling solution. ROG Intelligent Cooling is the culmination of more than a decade of research and design to curate the perfect combination of cooling technologies for each individual machine. From liquid metal thermal compound, advanced heatpipes, vapor chambers, high density copper fin heatsinks, or tri-fan designs, ROG Intelligent Cooling has the tools to keep laptops of every form factor running cool and quiet during intense gaming sessions. Whether you have an ultra-thin Flow device, an ultra-powerful Strix SCAR laptop, or the incredibly portable ROG Ally handheld, our engineers have custom-tailored cooling solutions to keep you gaming at your very best.

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HEAT GENERATION

When electricity passes through silicon to perform a calculation, the chip in question produces heat, which needs to be expelled from the system to keep the machine running smoothly. Higher performance parts usually push more power to the CPU and GPU, resulting in more heat generation. By cooling key areas like the keyboard and palm rest, ROG Intelligent Cooling leverages all of the power from flagship components without compromising comfort or useability.

DIRECT CONTACT

All processors and other heat-generating components require a layer of thermally conductive material to efficiently move heat out of the system. While copper and aluminum heatsinks are great thermal conductors, they need a bridge for the tiny air gaps between them and the silicon itself.

LIQUID METAL
Liquid Metal Conductonaut Extreme

LIQUID METAL

Generally this bridging will be with a traditional thermal paste, but ROG Intelligent Cooling takes it to the next level. For the last few years, we have been using liquid metal to cool both the laptop’s CPU, and in select models, the GPU as well. Liquid metal has some design challenges, since it is also electrically conductive, but by being the first manufacturer harness the raw performance of this incredible thermal interface material on a mass production scale, we can push cooling performance of our laptops to incredible heights.

Liquid Metal Conductonaut Extreme

Select ROG models feature Thermal Grizzly’s cutting-edge Conductonaut Extreme, which improves liquid metal's heat transfer even further. Compared to traditional thermal pastes, this indium- and gallium-based compound offers 17X higher conductivity and CPU/GPU temperatures up to 15 degrees cooler. Used exclusively by ROG, this material offers the highest thermal transfer available on a laptop.

*Temperature improvements compared to the previous gen thermal compound, as tested internally by ASUS. Thermal conductivity compared to industry standard.

Heat transfer

Once heat has been successfully pulled from a component, it needs to be transferred out of the system. Depending on the laptop form factor and thermal load, at ROG we equip our machines with either a heatpipe system or a vapor chamber to ensure every machine operates at its peak efficiency.

HEATPIPES
Vapor chamber

HEATPIPES

Every laptop we design is unique, with different thermal loads, thicknesses, and placement of the heat generating components like the CPU and GPU. Our comprehensive solution uses up to seven heatpipes and quad heatsinks for efficient dissipation across all internal components, and each machine has a custom heatpipe layout to maximize cooling efficiency for that specific model. By carefully routing the pipes not only from the CPU and GPU but also over the VRM and RAM components, the entire system breathes better and stays cooler for better stability over time.

Vapor chamber

When the situation demands it, we can also equip ROG machines with a vapor chamber. Vapor chambers transfer heat very efficiently over large surface areas, and are a great choice when you need to spread a heat load evenly in all directions. We also equip the vapor chambers with a large rectangular plate, allowing it to pull heat from not only the CPU and GPU, but the VRM circuitry as well, keeping the system temperatures lower across the motherboard for long term stability and reliability.

Heatsink

Once the heat has been pulled from the components, it still needs to be ejected from the system once and for all. That is where a heatsink comes in, providing a location for the final transfer of heat from the heatpipe or vapor chamber to the ambient air. High density fins allow for efficient thermal transfer without adding bulk to the machines.

0.1 ultrathin fin
Full-width heatsink

0.1 ultrathin fin

ROG Intelligent Cooling technology utilizes ultra-thin copper fins measuring just 0.1mm thick to achieve a higher density in each heatsink. Depending on the model of laptop, up to 252 heatsink fins total 110,328mm² of surface area. These fins are half the thickness of a typical solution, granting ROG devices incredible cooling efficiency without added bulk.

Full-width heatsink

The Flow X16, as well as the Strix SCAR 16 and SCAR 18, feature a brand new full-width heatsink. Covering the entire rear of the machine to maximize size while also reducing air resistance for incredible cooling efficiency, these full-width heatsinks increased total surface area by up to 82.5% from the 2022 models.

Airflow

Airflow is critical to overall cooling performance and heatsink efficiency, so we’ve leveraged a variety of Intelligent Cooling technologies to maximize performance. From our variable thickness Arc Flow Fans™, directed internal flow to keep key components cool, and novel layouts that sometimes include a third auxiliary fan, ROG continues to blow away the competition.

Arc Flow fans
Tri-Fan Technology
Full-surround vents

Arc Flow fans

Our Arc Flow Fans™ use blades of variable thickness and shape to reduce turbulence and maximize airflow efficiency. By changing from a high to low pressure area gradually before being expelled by the fan, the air turbulence is drastically reduced compared to traditional fan blade designs. This patented design is made possible by the latest liquid-crystal-polymer processing technologies that allow us to create ultrathin, strong fan blades for increased air intake.

The Arc Flow fan was inspired by the most aerodynamic designs found in nature. The blade caps use a wave pattern that guides the flow of air around the fan while minimizing turbulence for maximum efficiency, and each blade is also capped with a tip to regulate airflow, both of which mimic the design of a bird's wing for efficient flight.

Tri-Fan Technology

At the heart of every great laptop is a great cooling solution. Our new Tri-Fan Technology directs air though precisely calculated cutouts in the chassis, sending airflow directly towards internal components to keep them cool in all conditions. A third auxiliary fan also helps to send additional heat from the GPU directly to the heatsinks, keeping the machine cool during long video renders or gaming sessions.

Full-surround vents

Hot air needs somewhere to go, so we redesigned the Flow X16 and Strix 16/18 series' exhaust vents to give it the best flow possible. In addition to making the entire rear of the machine an exhaust vent, the Flow X16 and Strix 16/18 retain the side vents, giving it ample opportunity to move hot air out of the system. The chassis itself was also moved even closer to the heatsinks, giving hot air a straight-line path out of the machine and avoiding any recirculation.

Anti-dust Technology

Dust is the silent killer of cooling efficiency, so we’ve taken multiple steps to keep your system running smoothly for years to come. From a specialized dust filter to minimize dust and debris inside the chassis to special anti-dust tunnels built to eject any dust that does infiltrate, ROG Intelligent Cooling is a clean solution.

Anti-dust filter
Anti-dust tunnel

Anti-dust filter

First introduced on the Zephyrus G14, select ROG models feature a dust filter on their intake vents. Dust and fibers can collect inside the machine, trapping heat and causing degraded performance over time. A filter helps keep dust out, allowing the CPU and GPU to breathe easier for years of smooth and stable operation. Now available on the Zephyrus G14, Flow X13, Flow X16, and the ROG Ally, keep the air clean with our integrated dust filters.

*Internal testing in a simulated dusty environment.

Anti-dust tunnel

Our upgraded thermal module design features shorter anti-dust tunnels that leave up to 5% more space around the fan, improving airflow by up to 15%. Preventing the buildup of dust ensures the long-term stability and reliability of your system.

Advanced Technology

ROG is always pushing the boundaries of cooling performance and customizing the thermal design for each specific machine. From the revolutionary Active Aerodynamic System Plus found on the Zephyrus Duo 16, to the free-standing form factors of the Flow series, ROG Intelligent Cooling is always thinking outside the box to give you the best gaming experiences possible.

AAS+ 2.0
Stand mode
Zero Gravity

AAS+ 2.0

Featured exclusively on the ROG Zephyrus Duo 16, the Active Aerodynamic System Plus (AAS+ 2.0) opens a massive 28.5mm air intake behind the tilted secondary display that increases airflow by up to 30%. Instead of drawing in air from below the laptop, where components can warm incoming air and a desk may restrict airflow, this top-facing vent draws cooler air from above. The larger space also helps keep noise levels below 43dB in Performance Mode, keeping noise levels to a minimum even under heavy loads.

*Exclusive on ROG Zephyrus Duo series.

Stand mode

Traditional laptops place their main components and cooling solutions in the bottom of the chassis, but our Flow series of laptops flips convention on its head. As a tablet, the Flow Z13 features all of its components behind the screen, meaning that when the kickstand is deployed, it has unimpeded access to fresh air. This allows the Z13 to remain whisper quiet even under full gaming loads. While the Flow X13 and X16 are clamshell laptops, their 360° hinges allow them to operate in stand mode just like the Flow Z13 and keep their fan intakes well above the surface of a desk for free access to airflow.

Zero Gravity

We designed an all new system for the ROG Ally, a gaming handheld that is meant to be held and played from all different orientations. Starting with the internal structure of the heatpipes, we changed that structure of the wick to increase capillary pressure by more than 15%, allowing heat to cycle efficiently even when used completely inverted. The fans also need to run without issue when used in non-traditional orientations, so we made a departure from our Arc Flow Fans™ to use a new fluid bearing design for incredibly low friction. This reduces wear and tear on the fans no matter how you use the device for years and years of gaming.

Software solution

Top-tier hardware will take you far, but it needs a suite of software to optimize it for any scenario. We’ve done just that, with built-in tools to keep you focused on the game without interruption. Silent, Performance, and Turbo modes adjust power delivery and fan curves dynamically, keeping the machine cool and quiet no matter what you’re doing.

Scenario profile
0dB Ambient Cooling

Scenario profile

Performance modes are just the beginning. Scenario Profiles allow your system to automatically switch between them based on the application you're running, alongside other vital system settings. Switch between lighting configurations automatically, disable the Windows key and touchpad during games, and automate to your heart's content. Armoury Crate makes adjustments in an instant to best fit the task at hand.

0dB Ambient Cooling

Enjoy truly silent cooling under light workloads with 0dB Ambient Cooling. In the Silent operating mode, the cooling system switches off all fans during everyday tasks to dissipate heat passively. The combination of high efficiency thermal interface materials, carefully routed heatpipes or custom vapor chambers and high performance heatisinks allow our machines to dissipate heat without any air movement. This lets you concentrate on your work and immerse yourself in movies with less distraction. If CPU or GPU temperatures increase, the fans automatically switch on again.

/USER SCENARIO
MODES

  • PERFORMANCE
    MODE

  • SILENT
    MODE

  • TURBO
    MODE

COMPARISON TABLE

Features

ROG Strix SCAR 18

ROG Strix SCAR 16

ROG Strix SCAR 17

ROG Strix G18

ROG Strix G16

ROG Strix G17

ROG Flow X16

ROG Flow X13

ROG Flow Z13

ROG Zephyrus Duo 16

ROG Zephyrus G14

ROG Zephyrus G16

ROG Zephyrus M16
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Liquid Metal

conductonaut extreme on CPU & GPU

conductonaut extreme on CPU & GPU

conductonaut extreme on CPU & GPU

conductonaut extremeon on CPU & GPU / only on CPU
*actual spec vary by sku, please visit product page for detailed sku info

conductonaut extremeon on CPU & GPU / only on CPU
*actual spec vary by sku, please visit product page for detailed sku info

conductonaut extreme on CPU

on CPU

on CPU

on CPU

conductonaut extreme on CPU

on CPU

on CPU

on CPU
Heat Pipes

v

v

v

v

v

v

v

v

x

v

v

v

v
Vapor Chamber

x

x

v

x

x

x

x

x

v

x

v

x

x
0.1mm Ultra Thin Fins

v

v

v

v

v/x
*actual spec vary by sku, please visit product page for detailed sku info

v

x

x

v

v

x

x

x
Full-width Heatsink

v

v

x

v

v

x

v

x

x

x

x

x

v
Full-surround Vents

v

v

x

v

v

x

x

x

x

x

x

x

x
Tri-fan Technology

v

v

x

v

v/x
*actual spec vary by sku, please visit product page for detailed sku info

x

v

x

x

x

x

x

v
Arc Flow Fans

v

v

v

v

v

v

v

v

v

v

v

v

v
Anti-dust Tunnel

x

x

x

x

x

v

x

v

v

x

v

x

x
Anti-dust Filter

v

v

v

v

v

x

v

v

x

v

v

v

v

Disclaimer

  • This device supports Wi-Fi 6E, the newest standard in wireless networking. Please note that Wi-Fi 6E is not yet available in all regions. If your country has not opened up the necessary Wi-Fi bands, this device will use the best connection available. ROG will release a software update to enable Wi-Fi 6E when it's available in your region.
  • Please note that this Xbox Game Pass offer must be redeemed within 180 days of activating Windows. Systems that have not activated Windows within two years of their manufacture date will be unable to redeem this offer.
  • The standard Asus test environment for battery life is as follows: Windows operating system, display module with 150 nits of brightness, lighting off, and other application settings.
  • Video Playback: Testing is done with Wi-Fi/Bluetooth off, Windows Power Plan set to Balanced, Taskbar Power Mode set to Battery Saver, system volume at 67%, and video at full screen, 1080p resolution
  • Web Browsing: Testing is done with Wi-Fi/Bluetooth, Windows Power Plan set to Balanced, Taskbar Power Mode set to Better Battery, and using the Weblooper Top50 website in Google Chrome to play the video with a refresh time of 10 seconds.
  • Factors that affect battery life include laptop configuration, power settings, and the way it is used. Battery capacity fades with its cycle count and age.
  • Quick-charging times apply when using the proper ASUS/ROG adapter included alongside the select model and the system is powered off (via the "shut down" command). In compatible scenarios, batteries can be recharged to 50% within 30 minutes under the optimal temperature range of 20-45 degrees Celsius. Charging times may vary +/- 10% due to system tolerance.
  • The terms HDMI, HDMI High-Definition Multimedia Interface, HDMI Trade dress and the HDMI Logos are trademarks or registered trademarks of HDMI Licensing Administrator, Inc.
  • The actual HDMI version of the products should be checked in the product specifications page respectively.
  • Unit with RJ45 port does not support “Power over Ethernet” (PoE), only support data transmission.
  • Products certified by the Federal Communications Commission and Industry Canada will be distributed in the United States and Canada. Please visit the ASUS USA and ASUS Canada websites for information about locally available products.
  • All specifications are subject to change without notice. Please check with your supplier for exact offers. Products may not be available in all markets.
  • Specifications and features vary by model, and all images are illustrative. Please refer to specification pages for full details.
  • PCB color and bundled software versions are subject to change without notice.
  • Brand and product names mentioned are trademarks of their respective companies.
  • Unless otherwise stated, all performance claims are based on theoretical performance. Actual figures may vary in real-world situations.
  • The actual transfer speed of USB 3.0, 3.1, 3.2, and/or Type-C will vary depending on many factors including the processing speed of the host device, file attributes and other factors related to system configuration and your operating environment.

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