TEAMED POWER ARCHITECTURE
12 + 1 + 1 power stages each rated to handle up to 60A deliver ample current to drive the most powerful Intel 13th Gen processors through any workload with ease.
ALLOY CHOKES AND DURABLE CAPACITORS
High-end chokes and durable capacitors are engineered to resist extreme temperatures, enabling performance that exceeds industry standards.
A multi-layered printed circuit board design quickly dissipates heat around the voltage regulators to improve overall system stability.
OptiMem II technology carefully maps memory signal pathways across different PCB layers to reduce path distance, and it adds shielding zones that significantly reduce crosstalk.
VRM HEATSINK ARRAY
Covering the power solution are two thick heatsinks with strategic airflow channels for increased heat dissipation while powering high-performance Intel 13th Gen processors.
Heatsinks cover both M.2 slots to help keep onboard NVME SSDs at optimal temperatures for consistent performance and reliability.
CPU FAN HEADERS
Positioned near the top of the motherboard, a pair of PWM/DC fan headers give easy access for CPU coolers.
AIO PUMP FAN HEADER
A dedicated PWM/DC header connects self-contained water-cooling setups.
4-PIN FAN HEADERS
The Strix B760-G D4 features two chassis fan headers, each supporting auto-detection of PWM or DC fans.