ROG Chill Case
ASUS estore price HK$299.00
ASUS estore price HK$299.00
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ROG PHONE CHILL CASE

Stay cool, sound great

Two ROG Chill Cases: one case is attached to the phone, and the other is standing alone beside it.
Leveraging the ROG Phone’s advanced cooling technology, the ROG Phone Chill Case is the world’s first phone case with an integrated liquid cooling system, along with our unique Audio Redirect technology for front-facing sound. Enjoy immersive audio and keep your phone cooler for a comfortable, uninterrupted gaming experience.

Thermal

Chill out the heat

The ROG Phone Chill Case features a new Composite Vapor Chamber (CVC) material that efficiently dissipates heat away from your phone, reducing the temperature around the SoC by up to 17%1. This CVC is made of PC and PMMC materials2, offering thermal performance almost as good as copper but with zero impact on 5G and Wi-Fi connectivity.
Whether you’re in the middle of an intense battle or pushing your phone to the limits with demanding games, our Chill Case keeps your ROG Phone 9 Series running smoothly and comfortably in your hand.
The ROG Chill Case, with the composite vapor chamber inside, suspended against a background of light dots.
Up to
17%
temperature reduction1
Built-in
Composite Vapor Chamber
made of PC & PMMC material1

Sound

Immersive Front-Facing sound

The ROG Phone Chill Case also enhances your audio experience with our innovative Audio Redirect technology. Designed with precision-engineered sound channels, this feature redirects audio from the bottom speakers to the front, delivering a richer, more immersive sound experience.
Whether you’re gaming, watching videos, or listening to music, Audio Redirect ensures that every sound is clear and directed towards you, creating a more engaging and dynamic experience.
A ROG Phone 9 Pro in landscape orientation with the ROG Chill Case displaying a game. Circular sound effects emanate from both ends of the device.
Front-Facing
Audio Redirect
  1. All images are simulated for illustration purpose.
  1. Test result provided by ASUS labs, compared to the surface temperature of ROG Phone 9 without ROG Phone Chill Case.↑
  2. The materials are PC (Polycarbonate) and PMMC (Polymethyl methacrylate composite).↑

CUSTOMER REVIEWS

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Disclaimer

  • Products certified by the Federal Communications Commission and Industry Canada will be distributed in the United States and Canada. Please visit the ASUS USA and ASUS Canada websites for information about locally available products.
  • All specifications are subject to change without notice. Please check with your supplier for exact offers. Products may not be available in all markets.
  • Specifications and features vary by model, and all images are illustrative. Please refer to specification pages for full details.
  • PCB color and bundled software versions are subject to change without notice.
  • Brand and product names mentioned are trademarks of their respective companies.
  • Unless otherwise stated, all performance claims are based on theoretical performance. Actual figures may vary in real-world situations.
  • The actual transfer speed of USB 3.0, 3.1, 3.2, and/or Type-C will vary depending on many factors including the processing speed of the host device, file attributes and other factors related to system configuration and your operating environment.