Hello all, I need a few opinions for my current build. Right now I'm using a 3950x on a x570-i Motherboard and it runs a bit hot in the Gamerstorm Tristellar Case. (yay, looks)
However because of the way the case sits the board is at a 30 degree tilt from being level from the ground. Because of this I got a Carbonaut Thermal pad to interface between the chip and the pump (Artic freezer II 120, 120 because that's all that fits with this case model). It's not ideal for overclocking as it heats up my room but it works.
I know the obvious answer is to replace it with a thermal paste but I'm not too good at remembering to replace it every 6 months-Year to keep temps down and I do have some spare conductonaut from my last chips delidding. However with all of this in mind I'm worried about the slide from the angle.
Should I use paste, metal or keep on trucking with the Carbon pad?
If so what are your recommendations and why?