ROG Chill Case
Harga ASUS Rp 499.000
Harga ASUS Rp 499.000
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ROG PHONE CHILL CASE

Tetap dingin, suara mantap

Two ROG Chill Cases: one case is attached to the phone, and the other is standing alone beside it.
Memanfaatkan teknologi pendinginan canggih dari ROG Phone, Casing Dingin ROG Phone adalah casing ponsel pertama di dunia dengan sistem pendingin cairan terintegrasi, ditambah teknologi Arahkan Ulang Audio unik kami untuk suara menghadap depan. Nikmati audio yang mendalam dan jaga ponsel Anda tetap dingin untuk pengalaman bermain game yang nyaman dan tanpa gangguan.

Termal

Dinginkan panasnya

Casing Dingin ROG Phone memiliki material Ruang Uap Komposit (CVC) baru yang secara efisien menghilangkan panas dari ponsel Anda, mengurangi suhu di sekitar SoC hingga 17%1. CVC ini terbuat dari bahan PC dan PMMC2, menawarkan performa termal yang hampir sama baiknya dengan tembaga tetapi tanpa dampak pada konektivitas 5G dan Wi-Fi.
Baik Anda berada di tengah-tengah pertempuran sengit atau mendorong ponsel Anda hingga batasnya dengan game yang berat, Casing Dingin kami menjaga Seri ROG Phone 9 Anda tetap berjalan lancar dan nyaman di tangan Anda.
The ROG Chill Case, with the composite vapor chamber inside, suspended against a background of light dots.
Up to
17%
temperature reduction1
Built-in
Composite Vapor Chamber
made of PC & PMMC material1

Suara

Suara Depan yang Mendalam

Casing Dingin ROG Phone juga meningkatkan pengalaman audio Anda dengan teknologi Arahkan Ulang Audio inovatif kami. Dirancang dengan saluran suara yang direkayasa secara presisi, fitur ini mengarahkan ulang audio dari speaker bawah ke depan, memberikan pengalaman suara yang lebih kaya dan lebih mendalam.
Baik Anda bermain game, menonton video, atau mendengarkan musik, Arahkan Ulang Audio memastikan bahwa setiap suara jelas dan diarahkan ke Anda, menciptakan pengalaman yang lebih menarik dan dinamis.
A ROG Phone 9 Pro in landscape orientation with the ROG Chill Case displaying a game. Circular sound effects emanate from both ends of the device.
Front-Facing
Audio Redirect
  1. All images are simulated for illustration purpose.
  1. Test result provided by ASUS labs, compared to the surface temperature of ROG Phone 9 without ROG Phone Chill Case.↑
  2. The materials are PC (Polycarbonate) and PMMC (Polymethyl methacrylate composite).↑

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Disclaimer

  • Products certified by the Federal Communications Commission and Industry Canada will be distributed in the United States and Canada. Please visit the ASUS USA and ASUS Canada websites for information about locally available products.
  • All specifications are subject to change without notice. Please check with your supplier for exact offers. Products may not be available in all markets.
  • Specifications and features vary by model, and all images are illustrative. Please refer to specification pages for full details.
  • PCB color and bundled software versions are subject to change without notice.
  • Brand and product names mentioned are trademarks of their respective companies.
  • Unless otherwise stated, all performance claims are based on theoretical performance. Actual figures may vary in real-world situations.
  • The actual transfer speed of USB 3.0, 3.1, 3.2, and/or Type-C will vary depending on many factors including the processing speed of the host device, file attributes and other factors related to system configuration and your operating environment.