ASUS Straight Edge Podcast: Episode 3 - CPU Q&A with Intel
The ASUS Straight Edge podcast returns with a new episode featuring longtime Intel PR manager Dan Snyder, and strategic marketing lead for enthusiasts, Aaron Mcgavock. With 40 years of experience at Intel between them, Dan and Aaron have lots of insights related to tech and media to share. We present our questions and yours, to dig deep and get the nitty gritty details. These guys both have engineering backgrounds - this is not an episode to miss!
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Timeline
Intro and guest bio 0:00~2:04
History
Conroe, Intel's game-changing architecture 2:04~5:25
Changes in tech media/PR 5:25 ~ 8:18
Future
Where does Intel see the desktop market going over the next five years? 8:18~10:56
What’s the long-term outlook for HEDT product line? 10:56~13:30
Chipset release cadence
Why are enthusiast platforms updated slower than desktop platforms? 13:30~15:40
Overclocking
Intel’s changing stance on overclocking 15:40~18:30
Why are Xeon CPUs locked? 18:30~21:20
Why did Intel remove overclocking from non-K CPUs? 21:20~24:05
What’s the best way to stress test a CPU? 24:05~26:30
What determines the choice of thermal interface material for various CPUs? 26:30~29:40
What determines the gap between the CPU die and IHS? 29:40~34:21
Outside of silicon design, what can be done to improve CPU performance? 34:22~35:39
6700K overclocking – why are yields so good? 35:39~37:21
VR & Gaming
Why do K series CPUs have an IGP? 37:25~40:33
How can Intel help improve VR performance? 40:33~43:20
Mobile
Intel’s Speedshift versus SpeedStep – what’s the difference? 43:21~47:20
Will there be a Skylake phone? Is making one possible given there is a Core M compute stick? 47:21~48:40